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Electron-Beam, Ion-Beam and Magnetron Deposition and Coating Systems
This annual product showcase describes and updates many types of the thin-film deposition and coating systems used in a wide variety of production, R&D and other applications.
Compiled by Terrence Thompson, Contributing Editor
Increasingly versatile vacuum-based, thin-film deposition and coating systems just keep getting better and better. Cost-effective and efficient deposition technologies are available for a wide range of thin-film materials to provide end users with many options. Depending upon the system and technology selected, systems can form layers with thicknesses ranging from of a few nanometers to several microns.
Thin film deposition technologies can be physical, evaporative and sputtering systems, or chemical including gas and liquid phase processes. Some processes are based on glow discharges and reactive sputtering which combine physical and chemical reactions are known as physical chemical methods.
Thin-film deposition and coating applications are fast-growing, continuing to find new uses ranging from razor blade coatings to quantum-well lasers to superconductors. Advances in thin-film technology for semiconductors, MEMS and photonic devices enable ongoing advanced device fabrication, advanced discrete and wafer-level packaging of microcircuits and optical devices. Applications such as hard-amorphous carbon deposition and metal-interconnect deposition schemes are widely used in semiconductor manufacturing. Other applications benefiting from extremely hard coatings are cutting and forming tools where coatings reduce friction and wear with coating materials such as TiN, CrN, TiCN and AlTiN.
Product Descriptions
In the following product descriptions, vendors make valid distinctions to focus on specific niche market segments so direct comparisons may be difficult. When in doubt, go to Vacuum Technology & Coating magazine’s home page at and click on the advertiser links for additional details or telephone numbers for calling to discuss your specific application requirements. With their experience, they can help you make the right choices.
ATC ORION Series Deposition Systems—Compact, Cost Effective, Research Tools with Modular Design
AJA International, Inc.’s introduced its ATC ORION  Series deposition system, a compact, feature rich, premium quality alternative for researchers with limited budgets. Derived from the heritage of the larger, highly popular ATC Series Magnetron Sputter Systems, the ATC ORION offers a design approach that is unrivaled in today's market: All modules are field retrofitable including computer control. These compact tools are available with 1-10 Torr magnetron sputter sources and can be either HV or full UHV design. The integrated 2-inch magnetrons are special versions of the field proven A300-XP and Stiletto Series modular magnetron sputter sources (over 4000 of these sources operate worldwide). Substrate cooling/heating from LN2 to 1000°C, substrate rotation, substrate RF/DC bias, substrate Z motion, turbo load-lock, RF/DC generators, pulsed DC, automatic closed-loop downstream pressure control and computer control are just a few of the available option modules. Finally, in the tradition of AJA's highly uniform, con-focal deposition designs, the ATC ORION delivers a minimum guaranteed ± 2.5% thickness uniformity over 4 inches for any material due to a special source design feature (patent applied). www.ajaint.com
ATC 1500-E HYBRID UHV Deposition Systems —Sputtering for E-Beam/K-Cell/Thermal/ Ion Beam/Anneal/B Field
AJA International, Inc. has delivered numerous, multichamber  ATC HYBRID deposition systems with a variety of deposition/modification/analysis techniques such as on axis, con-focal and off-axis magnetron sputtering, evaporation, oxygen anneal, transverse magnetic field application, ion beam assist, milling and oxygenation, RHEED and finally post deposition surface analysis. These UHV chambers are connected via UHV gate valves and magnetic linear transfer tools allowing multiple, incompatible processing steps to be performed on a single substrate without exposure to atmosphere. AJA International, Inc.’s ATC and ATC ORION SERIES deposition systems are always designed to allow attachment of appendage chambers thereby creating the possibility of future ATC HYBRID systems as single purpose tools are expanded. www.ajaint.com
ATC 2200 IBAD with ICP Source with 3.0 × 10-4 Torr Deposition Pressure at 1/2 the Cost of Dual Ion Beam
AJA International, Inc.’s ATC 2200 IBAD coating tool operates in the same pressure regime as a dual ion beam system. Traditionally, magnetron sputter sources were unable to sustain their plasma discharge at the pressure where ion sources were most efficient (optimum flux and energy). AJA International, Inc. has now developed a new version of the A300-XP Series Magnetron Sputter Source which is capable of operating into the high 10-5 Torr range and still includes all the features which deliver ±2% uniformity over substrates up to 8 inches diameter. Combining 3 to 4 of these low-pressure magnetrons with an ICP RF Plasma/Ion Source delivers highly uniform, ion assisted depositions at rates identical to dual ion beam systems. The ICP source also can be used for milling/pre-cleaning, oxygenation/nitridization (80% + dissociation of O2 and N2) and PECVD. The ATC 2200 IBAD features an metal sealed UHV design, substrate heating up to 1000°C and substrate bias (RF or DC). Operation and geometries are significantly simplified versus dual ion beam systems and the cost is typically much lower to achieve the same results.
AJA International, Inc.
Scituate, MA
www.ajaint.com
Contact: William Hale, President
Tel: 1-781-545-7365
E-mail: topgun@ajaint.com
Hummer 8 Series Planar Magnetron Sputter Systems for Thin-Film Deposition, called 0031307
The AnatechUSA Tabletop thin-film deposition systems (Hummer 6.6 with tilt/rotate stage and thickness monitor shown here) are sized for Scanning Electron Microscopy sample preparation, research and development, failure analysis and quality assurance applications may be configured for sample preparation for gold coating, CV dot matrix aluminum deposition, silicon dioxide deposition; DC sputter of metals and RF sputter of insulators and metals up to 8-inch diameter substrates.
Hummer 12 Series Planar Magnetron Sputter Systems for Thin-Film Deposition
The AnatechUSA Thin-film deposition systems are sized for research and development, failure analysis and quality assurance applications may be configured for CV dot matrix aluminum deposition, silicon dioxide deposition; consecutive or concurrent DC sputter of metals and RF sputter of insulators and metals up to 12-inch diameter substrates.
AnatechUSA
Hayward, CA
Tel: 1-800-390-4449 or 1-510-732-6961
Web Roller-Coaters for Thin-Film Deposition
CHA Industries provides web  roller-coaters for thin-film deposition applications that are individually configured to meet endusers requirements. Production capability ranges from small R&D quantities to full production runs. CHA’s web roll-coaters are capable of processing plastics, metal ribbon, and metal foil substrates in a wide thickness range. Applicable industries include photo- voltaics, superconductors, OLEDs, flexible circuits and displays, and optical and barrier coatings. CHA has experience integrating sputter magnetrons, electronbeam guns, resistance sources, ion-guns, and plasma bars into their web roll-coaters. Sputter sources may be configured for direct (chill-drum) or free-span (gentle roll wrap) deposition. For optimal film uniformity and throughput, CHA provides PLC automated process control with a real-time interactive HMI, digital control of web speed, tension, and accurate rewind, and closed-loop pressure and flow control of multiple reactive and non-reactive process gases. CHA is one of the principal tool suppliers to the U.S. Display Consortium for the development of flexible displays.
CHA Industries
Fremont, CA
Tel: 1-510-683-8554
Explorer® Thin Film Deposition Platform
The Denton Vacuum LLC Explorer offers the thin film user a flexible platform for deposition by electron beam, resistance evaporation, or sputtering on a cost-effective platform. PLC Automation is included as standard. The option to add a load-lock, additional deposition sources and an ion source are available. For very sophisticated processes, Denton’s ProcessPro software is available. Denton specializes in offering custom thin film solutions to specific application requirements. By taking a flexible approach and discussing process requirements, Denton is able to offer the user a system configured to meet specific performance objectives. With many Explorer units installed, Denton offers 40 years of thin film experience to its customers. www.dentonvacuum.com
Discovery® -HDG Family of Ion Beam Deposition Systems
Denton Vacuum LLC’s Discovery® -HDG family of ion-beam  deposition systems. The Discovery® -HDG was developed to address the needs of leading-edge R&D activities and pilot-scale production efforts that require maximum uptime, flexibility and materials choices. “Powered by Veeco’s leading edge ion source technology,” the Discovery® -HDG supports deposition sources 3-6 cm in diameter and etch/assist sources from 3 to 16 cm. Various tooling options are available from manual/automatic tilt (water- cooled) single rotation stages to watercooled, tilting planetaries. As with all Denton systems, the Discovery® -HDG incorporates best in class components, automation, and process support. The system is CE compliant and serviced by Denton’s worldwide organization. www.dentonvacuum.com
Integrity Series Evaporation
The Denton Vacuum LLC Integrity series provides evaporation technology using multiple resistance and electron beam gun configurations. Chamber geometry is optimised for the specific application. IAD processes, optical monitoring and sophisticated automation and controls are typical features of these machines. Various fixturing arrangements offer increased uniformity and flip-over tooling is available for coating both sides of a substrate. The Integrity has been supplied in chamber sizes from 20 to 80 inches for applications as diverse as ophthalmic coating, laser bar facet coating, precision optics and optical filters. The Explorer series offers small scale manufacture and R&D application with various configurations in a small footprint. A single electron-beam gun can be configured with IAD and sputtering cathodes for development applications. Denton Vacuum has over 40 years as a leading supplier of thin-film coating equipment with an established range of systems offering flexibility and performance to meet the most demanding applications. Denton offers a unique combination of hardware configuration, automation and controls, and process assistance to create powerful depositions systems for industry and research.
Denton Vacuum U.S.A.
Moorestown, NJ
www.dentonvacuum.com
Tel: 1-856-439-9100
E-mail: info@dentonvacuum.com
Ferrotec Multihearth Electron Beam Evaporators
Ferrotec‘s multihearth evaporators are used for thin film  coating. All sources serve a wide range of optical and microelectronic applications. The EV M-10 is the new high capacity Electron Beam source, designed by FerroTec Germany. It has been designed for applications requiring the deposition large amounts of material as well as large volume vacuum coating chambers. This source incorporates well proven e-beam technology including water cooling, rotary drive and magnetic components. Moreover, its newly designed source body, crucibles and the filament block result in a more efficient and effective operation. The EV M-5II is a general-purpose multi-hearth source for use up to a maximum power of 5 kW. It is ideal for applications requiring high deposition rates and effective material utilization. Typical applications are production coatings or laboratory-scale evaporations with a variety of different materials or with materials which require continuous pocket rotation. The EV M-6 and M-8 are professional multi-hearth sources for optical and other high precision applications. The EV M-6 has a maximum power of 6 kW and the EV M-8 can be used at powers of up to 10 kW. These evaporators offer a small beam spot regardless of position in the pocket and extremely homogenous material depletion. This makes them ideal for precision applications such as optical coating.
Ferrotec (USA) Corporation
Bedford, NH
Tel: 1-603-472-6800
Nanochrome I Load Lock
Intlvac’s Nanochrome™ I Load Lock  system (NCI-LL) is a high-precision R & D/Pilot Electron Beam Evaporator. Numerous configurations are possible, all tailored to your specific application. With it’s small footprint, low cost, and ease of operation, the NCI-LL systems is an ideal choice for pilot projects and research. The NCI-LL system incorporates a clamshell style chamber, which gives you easy access to all parts of the chamber. It can be built for a number of different substrate holders such as: flat plate planetary, flip fixture planetary or a planetary dome. Substrate revolution and rotation ensures an even coating. Inside the NCI-LL, there are quartz halogen lamp heaters and fully automated shutters for total process control. www.intlvac.com
Nanochrome II Load Lock
Intlvac’s Nanochrome™ II Load-Lock (NCII-LL) is  an ideal tool for metal films, optical and precision optical coating. Our 32”x36” chamber supports a wide variety of substrate holders such as: flat plate planetary, planetary domes, flip fixtures and “Lift Off”. The system can be configured with a variety of thin film deposition sources such as electron beam guns, magnetron sputter cathodes, and thermal sources. Turn key process support is provided by Intlvac’s in house experts who can develop and custom tailor a deposition process from diamondlike carbon (DLC) coatings to AR coatings. The load-lock on the NCII-LL allows for fully automatic transfer of the substrate to the substrate holder in the chamber. www.intlvac.com
Nanoquest I Ion Beam Sputtering System
The Intlvac Nanoquest Research Ion Beam Sputtering  system is a flexible, low cost platform for advanced ion beam materials processing research. Utilizing a compact chamber configuration and a choice of vacuum pumping options, the Nanoquest can be configured with single or dual ion beams, multiple sputter targets, and reactive gas handling to perform inert or reactive etching and ion beam deposition. Key to the systems operation is a direct water-cooled substrate stage that provides rotation and tilt during deposition and etching. Ion Beam Sputtering can deposit insulators and conductors during the same run.
Intlvac
Georgetown, Ontario, Canada
www.intlvac.com
Contact: Miguel Pereira
Tel: 1-905-873-0166
E-mail: mpereira@intlvac.com
The Next Generation PVD Machine—Your Platform For Tailored Coatings
IonBond AG is a large, global, full  range supplier of PVD, CVD and PA-CVD equipment and services. The company has developed a platform approach from which three products are derived: The Road Runner rapid coater, the Insert Coater and the Easy Coater. Each machine is tailored to a specific market, based on a platform principle that incorporates numerous advances across the platform allowing for the deposition of more complex, smoother and thicker coatings, useful for certain targeted applications. Some of the key features are the high tech etching module for smooth and efficient etching, the ability to mix arc and sputter technology and the utilization of both round and planar targets for deposition of up to six materials simultaneously. These features have all been built around a platform that favours ease of use and rapid deposition rates to maximize productivity. The customer may choose a solution most suitable to their requirements. IonBond’s global surface treatment offer covering PVD, CVD, PA-CVD coatings, laser hardening technologies as well as combination of these treatments opens new production and performance possibilities. Headquartered in Switzerland, IonBond has 45 coating service locations covering North America, Europe and Asia.
IonBond AG Olten
CH-4600 Olten Switzerland
Tel: +41 62 287 85 12
KDF Electronic & Vacuum Services 900 Series In-Line Sputtering Tool For High Throughput Surface Acoustic Wave Manufacturing
KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. The 900 Series exceeds requirements for deposition of thin films in application critical devices and other applications requiring the absolute in uniformity. The 954NT is a four-target batch sputtering tool for frontand backside deposition. The tool, which is optimized for processing GaAs and other compound semiconductor applications, features a low cost of ownership, and enables high utilization and throughput. www.kdf.com
600 i Series Sputtering Systems
KDF’s 600 i Series is targeted towards  sensitive applications requiring material that produces particulate contamination. The tools in this family surpass the criteria for deposition of thin films in high-density devices and other applications requiring absolutely minimal defects. The 600 i Series features multi-process sputtering for increased process flexibility and higher throughput. The 643 i ’s advanced mechanical and electrical design features result in tight process control, high reliability and extremely low defect rate. Process control features include a palletized batch processing area that allows instantaneous changing of wafer sizes, enabling both front and back side GaAs wafer processing. In addition, a sophisticated temperature control system maintains low wafer temperature during heat sensitive sputtering phase. The 654 i and 654 ix systems were developed for the rapidly growing telecommunications and compound semiconductor markets, the 654 tools can be applied to a full range of leading edge microelectronic component manufacturing applications. The system provides enhanced etch and deposition uniformity and high-speed batch processing. Featuring cathode selectable collimator technology, the 654 ix substantially increases lift-off performance, an enabling sputtering capability that raises the system's overall cost effectiveness. Capable of integration with current systems, the new 654 ix was developed to provide increased volume capacity by enabling multiple substrate material processing, or “multiplexing.” www.kdf.com
744 i Large Area, Four-Target, Batch Sputtering System
The KDF 700 i Series includes the KDF 744 i large area, fourtarget, batch sputtering system, designed for processing high-density interconnect, 200mm semiconductor wafers and flat panel displays. The tool was developed to meet increasing customer demand for higher throughput with larger substrates. It is a vertical sputtering system with a 19 × 19-inch pallet area. The compact footprint uses less than one-third the floor space of most competing equipment. High-vacuum loadlock, a capacity to process up to four 200mm wafers or multiple smaller wafers at a time and throughput for 200mm wafer metallurgy is increased four times with cassette-to-cassette capability. The tool features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers. The 744 i is also available as an enhanced tool with a Negative Sputter Ion Beam that provides excellent ITO coatings on polycarbonate substrates at very low temperatures. www.kdf.com
844 i Large Area Sputtering System
The KDF 844 i is a large area system targeted  at the demanding process requirements of high-density interconnect, 300mm semiconductor wafers and flat panel displays. This system has been totally redesigned from the ground up and now utilizes some of the latest advances in today’s technology. The 844 i was conceived to meet increasing demand for higher throughput with larger substrates. Based on the company's productionproven platform of in-line sputtering systems, the 844 i offers manufacturers an efficient large area processor with the footprint of a small system. The tool features two processing palettes, allowing instantaneous change of wafer sizes and the ability to process both the front and back side of the wafer. Targets on the 844 i are available in a variety of highefficiency formats. The tool has a target utilization rate of up to 60 percent. www.kdf.com
KDF 944 i , 954 i and 954 ix Precision Sputtering Systems
The KDF 944 i, 954 i and 954 ix  systems meet today’s stringent production requirements asthe the 900 Series offers process flexibility typically found in R&D systems. The 900 Series surpasses the criteria for deposition of thin films in high-density devices and other applications requiring absolutely minimal defects. The 900 Series systems are equipped with KDF’s exclusive and innovative ERPP (enhanced rotary planetary pallet), which provides greatly improved wafer uniformities. In tandem with KDF’s cathodes, this pallet option can achieve better than ±1% uniformities across the pallet and better than 0.5% repeatabilities between runs for dielectrics such as SiO2 and TiO2, compared with traditional pallet uniformities of ±15 to 20% for such materials. The 943 i is well suited for manufacturing thin films for hybrid circuits for defense, aerospace and space tele-communications applications. These applications normally require a repeatable, high-throughput process for producing uniform films. The 954 i is designed for processing GaAs and other compound semiconductor applications. The system is available in the standard 954 i configuration and as the 954 I, which offers the option of extended cathodes and increased uniformity. The 954 i is a four-target batch sputtering tool for both front and backside deposition, providing high utilization that increases cost-effectiveness and productivity. The 954 ix is equipped with extended cathodes and increased uniformity. www.kdf.com
i series System Controls Platform
After years of testing and evaluation, KDF has introduced the new i series controller, replacing the Brooks Automation Controller with new technology. This control system has been designed to be retrofitable, allowing an easy upgrade path for previous KDF models (ìT ì, ìGTî, and ìNTî). Although some older systems may require additional hardware upgrades to maintain compatibility with current and future system enhancements, doing so will bring these field proven systems to an even higher level of performance and reliability. This i series platform is based on a distributed Rockwell Automation Control System utilizing Devicenet and Ethernet I/P fieldbus technologies. These interfaces dramatically reduce the need for point to point wiring allowing for greatly increased reliability, easier troubleshooting, and a higher level of system integration reducing system part count (and spare part inventory). Easy system upgrade is accomplished with the use of flash memory. Windows XP Pro™ industrialized computer using the latest Intel Pentium Processor™ technology, Large Hard disk drive (80GB or better) for local recipe and data log storage, and an advanced graphics controller. Real-time GUI Environment, coupled with a SAW Touch screen and 19î LCD monitor. Surface Acoustic Wave touch screen technology guarantees virtually 100% optical transmission, and is not affected by the use of gloves. Context sensitive, multi-step (up to 200 steps/recipe) recipe manager is compatible with Microsoft Access™ database. Recipe storage is limited only by hard drive space (additional recipes can be stored on network drive). Fully integrated package for real-time data display, data logging is fully compatible with Excel™, Lotus™ and other windows applications, report generation, remote interface and printing. Secure remote diagnostics and software support available over the Internet (high speed connection required) with local firewall and anti-virus protection. OPC server interface allows SECS/GEM communication package (optional) and other applications to connect to a common database of machine I/O and system level data such as datalogs, recipes, RGA data, etc. Included is a maintenance test suite with full diagnostic and manual process control capability, along with a host of other macro sub-routine programs.
KDF Electronic & Vacuum Services, Inc.
Rockleigh, NJ
www.kdf.com
Tel: 1-201-784-5005
E-mail: sales@kdf.com
Nano 38 R&D Deposition system
The Kurt J. Lesker Company Nano 38 is an entry level, yet  highly capable, thin-film deposition tool suited for numerous R&D applications. It is offered in two models—Sputtering or Thermal Evaporation and is equipped with high vacuum pumping, substrate fixturing to suit a variety of customer needs, heating, and full PC control of deposition processes. As with all KJLC thin-film deposition tools the Nano 38 is manufactured from standard, process proven process modules. www.lesker.com
ALD (Atomic Layer Deposition) Systems
The Kurt J Lesker Company offers standalone Atomic Layer Deposition systems for the most demanding research applications. System features include: substrates to 200mm with heating to 600°C; plasma enhancement; maximum number of reactant inputs for liquids, solids, or gas; in-situ analysis capabilities; load lock; computer control; and much more. For further information e-mail ald@lesker.com. www.lesker.com
PVD 75 R&D Thin Film Deposition System
The Kurt J. Lesker Company PVD 75 is a  versatile, value engineered, R&D vacuum system that can be configured to suit a variety of thinfilm deposition applications. Standard features include: a front loading box chamber, turbomolecular pump package, integrated touch screen computer control, and a fully enclosed “zero” cleanroom footprint when flush wall mounted. Source flange options include magnetron sputtering, electron beam evaporation, thermal evaporation and low temperature evaporation furnaces (for organic materials). To ensure new product reliability, the PVD 75 is built using proven process modules from other standard Kurt Lesker Company thin-film deposition systems. www.lesker.com
PVD 250 Thin Film Deposition System
Kurt J. Lesker Co. manufactures the PVD 250 to address the  need for a cost effective, multi-technique deposition tool that can handle not only R&D, but that is also production capable. The PVD 250 can be equipped with a variety of PVD techniques such as magnetron sputtering (including reactive processes), thermal evaporation, and e-beam evaporation. Process options include: substrate heating/cooling , substrate biasing , and ion source installation. High substrate throughput is assured by several pumping options including cryopumps, turbopumps, and “in-chamber” cryogenic pumps for water vapor. Closed loop control of process parameters and fully automatic operation is achieved through each system's integrated process control. www.lesker.com
AXXIS Thin-Film Deposition System for R&D
Kurt J. Lesker Co.’s AXXIS is a  cost effective, versatile thinfilm deposition system for R&D and limited production applications. Although the AXXIS is a multi-technique system, it has a very small footprint. Its 304 SS chamber has a hinged front loading door, high vacuum pumping, enclosed frame, and safety interlocked operation. Standard deposition process modules are: magnetron sputtering, e-beam evaporation, and thermal evaporation. But the modular manufacturing approach allows easy adaptation to PECVD, plasma cleaning, and ion source installation. AXXIS produces single-layer and multi-layer films, and allows co-deposition. A variety of options are available including a Windows-based computer control system and a variety of substrate handling tools. www.lesker.com
KJLC Drum Coater Series
The Kurt J. Lesker Drum Coater Series of magnetron sputter  tools suit a wide variety of R&D and production process requirements. These versatile deposition tools are available with KJLC’s Performance Magnetron Sputter cathodes and as such deliver unmatched material utilization and tool uptime. The KJLC Drum Coater Series of machines address multiple sputtering technologies including reactive processes and can also be equipped with linear ion sources for surface modification or substrate cleaning and preparation. Numerous substrate fixtures are available depending on customer requirements. www.lesker.com
LAB 18 Thin Film Deposition Tool
The Kurt J. Lesker LAB 18 fills the need for a versatile yet  cost effective laboratory based thin film deposition tool. Magnetron sputtering, electron beam evaporation, thermal evaporation, ion assisted deposition and organic materials deposition are all possible with the LAB 18. Options include: load lock, substrate bias, substrate heating, analytical capability, and numerous pumping schemes. Its enclosed framework and integrated control system compliment its leading edge thin film capability. www.lesker.com
CMS Family of Deposition Systems
The Kurt J. Lesker Co. Combinatorial  Materials Science (CMS), initially developed to facilitate drug research, has been subsequently applied to new thin-film materials synthesis to enhance effects such as GMR. Our CMS thin-film deposition tools extend ‘traditional’ thin-film methods using combinatorial techniques into the rapidly advancing field of Spintronics. The CMS tools are modular, easily configured high vacuum and UHV tools for combinatorial PVD. The standard platforms, CMS-18, CMS-24, and CMS-A, distinguished by chamber diameters, allow an ever-greater variety of internal options. The standard PVD modules available are: magnetron sputtering, e-beam evaporation, k-cell sources, and thermal evaporation. But the CMS tools can be readily adapted to other techniques such as PECVD. All CMS Tools are available with load locks, specialized substrate stages, sequential or co-deposition capability, and a Windows-based comprehensive computer control system. Our modular manufacturing makes the CMS family highly reliable, exceptional versatile, cost effective, with a short delivery time. www.lesker.com
LUMINOS Cluster Tool
Kurt J. Lesker Co.’s LUMINOS  Tool is a multi-chamber thinfilm deposition and analysis system for R&D or pilot production applications. Its central distribution chamber is surrounded by a maximum of six radial process modules. The standard process modules are: substrate load lock; mask library; magnetron sputtering; thermal evaporation; electron beam evaporation; plasma cleaning; thermal annealing; oxidation; and analysis. The LUMINOS Tool is designed for any thin-film deposition, device fabrication, or analysis technique requiring in-vacuum transfer between chambers. Vacuum environments are high vacuum to true UHV. The base-level LUMINOS tool has manual substrate transfer. However, automated substrate transfer and a Windows-based comprehensive computer control package are options. www.lesker.com
Mini SPECTROS Organic Material Deposition Tool
Kurt J. Lesker Co.’s Mini SPECTROS is designed  exclusively for organic materials deposition. This tool enables deposition of organic materials for OLEDs, organic electronics, and organic photovoltaic applications. The Mini SPECTROS is provided with integrated process control of up to 6 low temperature evaporation furnaces (specifically for use with organic materials) enabling outstanding control of host/dopant ratios. The Mini SPECTROS is provided as a stand alone unit or complete with a glove box and glove box interface. www.lesker.com
SPECTROS™ Deposition System for R&D
Kurt J. Lesker Co.’s SPECTROS is a versatile  thinfilm deposition system for R&D investigations into small organic molecule devices. Applications include OLED, organic electronics and organic photovoltaics. The single chamber system has both organic and metal evaporation sources, in situ mask changing, and a glove box interface. The typical SPECTROS system has four Lesker LTE (low temperature) organic evaporation sources and two (high temperature) metal evaporation sources. At its limit, SPECTROS can have up to twelve organic sources and three metal sources simultaneously installed. Quartz crystal deposition monitors precisely control of film thickness and host/dopant ratios. A Windows-based, comprehensive computer-control package is included. www.lesker.com
OCTOS Cluster Tool
Kurt J. Lesker Co.’s OCTOS is a pre-production / full-production tool  for a range of PVD applications. It is based on a “cluster” platform with: entry and exit load locks; central robot distribution module; reactive plasma cleaning chamber; mask storage chamber; and various deposition chambers that can including magnetron sputtering, low temperature evaporation (for OLEDs), thermal evaporation, and e-beam evaporation techniques. OCTOS has exceptional layer thickness uniformity, repeatability, reliability, and substrate throughput. It is available in high vacuum and UHV versions and can be configured to process a range of substrates sizes including 6-inch diameter discs and 400 × 400mm plates. www.lesker.com
Custom Deposition Systems
Kurt J. Lesker Co. delivered its first  deposition vacuum system, well over 20 years ago. We designed it “from scratch” and delivered it meeting the customer’s specification. Over the years we have build many hundreds of complete systems and few thousand chambers. Today, at design and manufacturing locations in the U.S. and the U.K., we design, build, test, and delivers an exception range of standard and totally custom deposition systems. By leveraging this vast technical and engineering background, we have archived a staggering array of solutions to meet the most unique application requirements. Coupling this vast applications library, our vacuum engineering expertise, our modular manufacturing approach, and our huge machine shops equipped with the latest machining centers, we approach the most novel custom deposition application with: cost effective and proven design skills; thoroughly established assembly methods; an extensive base of systems testing; and confidence.
Kurt J. Lesker Co.
Clairton, PA
www.lesker.com
Contact: Duane Bingaman, Vice President, Sales and Marketing
Tel: 1-412-387-9200 or 1-800-245-1656
E-mail: pvd@lesker.com or salesus@lesker.com
HELIOS Innovative Sputtering System
The Leybold Optics HELIOS  sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. It is specialized for high-quality optical coatings with very low absorption and scattering. Excellent optical performance is ensured by the extremely dense, smooth, stoichiometric and amorphous layers. Ultimate precision in layer growth control is facilitated by an optical monitoring system (option) for in-situ on-substrate measurements. HELIOS can be used for a wide range of optical coating applications, including edge, bandpass, color, and UV/IR cut filters as well as beam splitters and laser mirrors. Besides optical coatings, other dielectric coatings (oxides, nitrides) as well as metallic coatings can be easily produced, depending on the source configuration of the HELIOS. Applications include precision optics; optoelectronics; sensors; and telecom. www.leyboldoptics.com
SYRUSpro CFM High Performance Coatings for Digital Optics
Optical thin film coatings are a key enabling technology for  digital optics. Constantly increasing demands on image resolution, contrast, color definition, and brightness place exacting requirements on the optical filter performance. The Leybold Optics SYRUSpro CFM is an innovative and cost-effective thin film coating solution for high performance optical filters, tailored to fulfill current and future requirements in digital optics. The APSpro ensures shift-free UV/IR cut filters (top), and excellent filter performance with high transmission and low ripple (bottom). Outstanding uniformity and reproducibility is demonstrated by the data of five substrate positions distributed over the calotte radius, and 6 consecutive production runs. Note: Measurement without backside AR coating. Today’s filters meet a growing range of performance parameters and must be produced within ever-shorter deadlines. This is why excellent quality is the basis for modern digital optics production. A cost-effective thin film deposition system must also deliver increased productivity through consistently high throughput and high yields. Higher product requirements combined with lower cost of ownership demands all add up to an increasingly challenging business environment for the filter manufacturer. Innovative production technology from Leybold Optics provides mass production solutions with outstanding performance, productivity and reliability. www.leyboldoptics.com
Boxer—A Mid-Size Solution for the Coating of Lenses, Display Systems
Uncompromising performance and a compact design are found  in the current Leybold Optics ’ BOXER model for prescription as well as for mass production optics. This maintenance-friendly system is suitable for clean room use. An effective electron beam evaporator does its work at the center of the coating chamber. Thanks to the unsurpassed Leybold Optics know-how the component parts of this system can be assembled in various cost-effective combinations to meet the individual requirements of customers. Leybold Optics is a leading manufacturer in this market. For display systems or the coating of lenses, flexible materials, and three-dimensional molded parts: our systems convince with their excellent results and their easy maintenance. From classical broadband anti-reflection coatings to absorption layers (protection against the sun)—a great number of different processes can be carried out with BOXER. Moreover, if the demands on the system happen to change, its hardware can easily be expanded.
Leybold Optics GmbH
Alzenau, Germany
www.leyboldoptics.com
Contact: Mrs. Isa Fröhling, Marketing Services
Tel: +49-(0)6023-500-190
E-Mail: marketingservices@leyboldoptics.com
Series PB3 Educational and Training Plasma System
Manitou Systems Inc. addresses the Systems Series PB3 Plasma System need for a flexible and low cost educational/proof of concept tool. This modular system is available with either a sputtering or high-density plasma source and includes only basic features. The chamber consists of a 6-inch cross, 4-inch diameter substrate holder, O-ring sealed door with view port and provisions for connecting a vacuum pump and pressure/flow measurement components. An integrated 13.56MHz RF generator and manual impedance matching network module complete the package. To keep the selling price low, the user can populate the PB3 with a vacuum pump, valves and other process related components from their own stock or by purchasing new components from a vendor.
Manitou Systems Inc.
Newton, CT
Tel: 1-203-270-8797
Building Blocks or Vacuum Science & Technology
This 528-page catalog details MDC’s expanded line of  high and ultrahigh vacuum components. From basic elastomer gaskets to sophisticated instruments for e-beam evaporation, MDC provides dependable and reliable solutions for vacuum science and technology. MDC’s comprehensive product line includes: Flanges & Fittings- Del-Seal™ CF, Kwik-Flange™ ISO KF, Large-Flange, TM ISO LF; Valves-Angle, Inline, Circular & Rectangular, Gate, Leak; Roughing Components; Foreline Traps, Sorption Pumps, Del-Flex TM process line, stainless steel flexible hoses; Electrical & Fluid Feedthroughs-Coaxial, Power, Instrumentation, Breaks & Envelopes; Motion & Manipulation-Rotary, Linear, Multi-Motion, XYZ Stages, Load-Locks, Motors; and Chambers- Surface Science, Bell Jars, Collars, Baseplates, Base Wells. MDC is committed to providing products and services that set the industry standard for customer satisfaction in quality, delivery and cost performance. www.mdcvacuum.com
MDC e-Vap® and Re-Vap™ Evaporators
MDC produces state-of-the-art thin film vacuum coating  equipment, and offers a wide range of choices and options in both, standard off-theshelf components and customize designs. MDC’s e-Vap® and Re-Vap™ product lines fully support electron beam or thermal evaporation methods. Featured products include the super economical and compact, 4 pocket, 3 kW, e-Vap® Mighty Source™ . Specifically tailored for pilot production, lab/R&D and the university marketplace, the Mighty Source™ provides the ideal deposition solution for your evaporation needs. Contact MDC now and request your free, Thin Film Product line brochure. www.mdcvacuum.com
MDC e-Vap® and Re-Vap™ E-Beam Thin Film Vacuum Coating Equipment
MDC produces state-of-the-art thin film  vacuum coating equipment, and offers a wide range of choices and options in both, standard off-theshelf components and customize designs. MDC’s e-Vap® and Re-Vap™ product lines fully support electron beam or thermal evaporation methods. Featured products include the super economical and compact, 4 pocket, 3 kW, e-Vap® Mighty ™ Source . Specifically tailored for pilot production, lab/R&D and ™ the university marketplace, the Mighty Source provides an effective deposition solution for your evaporation needs.
MDC Vacuum Products, LLC
Hayward, CA
www.mdcvacuum.com
Tel: 1-510-265-3500 or toll-free 1-800-443-8817
E-mail sales@mdcvacuum.com
602 Cluster Dielectric Sputtering Tools
MeiVac 602 multi-chamber tools are available with  single, double or triple chamber configurations employing RF Diode, RF Planar Magnetron or Pulsed DC Planar Magnetron deposition sources. These tools have become the workhorses of many 24/7 Hard Disk Drive Thin Film Head production fabs. Fully automated and employing Helium backside cooling to increase throughput, these tools can handle wafers up to 200mm round. Process chamber configurations are tailored to customer requirements. RF bias for stress reduction, improved uniformity and edge coverage is standard. Process optimization and characterization of alternate materials maximize the flexibility and life of this tool in and ever-changing technology. Hardware upgrades and/or retrofits associated with wafer sizes, pumping, deposition power sources, control systems etc. are routinely offered to further extend tool lifetimes. www.meivac.com
RF Diode Dielectric Sputtering Tools
MeiVac (Comptech) production dielectric sputtering systems are standards in the Magnetic Storage Industry, with over two hundred fifty, 2460 and 2480 systems installed worldwide. Systems offer batch processing and feature target/substrate carrier sizes of 17 ×17-inches (2460) or 20 × 20-inches (2480). Systems can be customized to address customer specifications for wafer size, load sizes, alternate materials and/or specific processes. RF bias is standard for stress reduction, improved uniformity and edge coverage. Helium backside cooling is offered to provide higher deposition rates. Process characterization/optimization is also offered. Hardware upgrades and/or retrofits associated with wafer sizes, pumping, deposition power sources, control systems etc. are routinely offered to extend tool lifetimes.
Meivac, Inc.
www.meivac.com
Contact: Harry Grover, Marketing and Sales Manager
Tel: 1-408-362-1000
E-mail: Harry.Grover@meivac.com
Delivery Module Enables TEOS-based SiO2 PECVD
Using the Oxford Instruments-Austin Scientific’s Plasmalab® System100 and Plasmalab® System133 process tools, TEOS (tetraethoxysilane, tetraethyl orthosilicate) offers an alternative PECVD precursor to the commonly-used silane (SiH4.) The complete TEOS PECVD system enables high quality, conformal deposition of SiO2 for photonics, dielectric layers and other structures together with control of film stress, deposition directionality and degree of step coverage by controlling oxygen radicals. The TEOS delivery module has an integrated purpose- designed solution with optimized heated delivery lines to ensure efficient, high-uniformity SiO2 PECVD processes and an easy source access and changeover. There is an optional glove-box which can be fitted onto the module for maximum safety and the module can be connected into a cleanroom extraction system if required. www.austinscientific.com
Oxford Instruments Atomic Layer Deposition Using FlexALTM Systems
Oxford Instruments-Austin Scientific’s FlexAL™ product family offers a unique new range of flexibility and capability in the engineering of nanoscale semiconductor structures and devices by combining remote plasma ALD processes with thermal ALD in a single system. Load-locked wafer entry and full 200 mm single-wafer capability add to the FlexAL™ tool’s ability to support the widest range of applications via the widest available range of precursors and materials. This product can be integrated into a cluster platform where required.
Oxford Instruments - Austin Scientific
Austin, TX
www.austinscientific.com
Contact: Todd Komanetsky
Tel: 1-512-441-6893
E-mail: Todd.Komanetsky@oxinst.com
A Wide Range of Customized Thin Film Deposition that Meet Sputtering Requirements
PVD Products effectively solves the sputtering needs of a  variety of applications facing industry today. Among them are not only Metals, Oxides, Carbides and and Nitrides, but also include Thin Film Batteries, Solar Cells. Transparent Conductive Oxides, and Thermal Barrier Coatings. In addition, one must include Sensors, C-C Buffer Layers as well as Medical Devices of different types. In addition, many other products may also be processed with PVD consistent sputtering depositions which are both economical and long-lasting.
Evaporation Type Deposition
PVD Products custom services include proven Evaporation technology designed  specifically to accommodate Thermal Concerns, E-Beam, IBAD, Co-Deposition and Glove Box Integration, each with thin film processing. All PVD depositions intensive quality assurance testing to meet the highest standards.
PLD Deposition
The broad extent of PVD deposition solutions incorporate targeted applications which require the most precise technologies. Typically, these consist of uses such for Superconductors, Coated Conductors, Buffer Layers, GMR,CMR, Maple, High-K Dielectrics, HP RHEED and Combinatorial Films. With PVD capabilities and facilities at your disposal, Deposition needs can be solved in a prompt and economic manner.
PVD Products, Inc.
Wilmington, MA
Tel: (978) 694-9455
jgreer@pvdproducts.com
SEMICORE Equipment SC 1500 In-line Sputtering System
Thin film coating for solar cells, hybrid circuits or any other PVD process moves forward with our latest generation of Semicore Equipment Inc.’s sputtering systems. pumping performance tracking. PPT allows every process run to be monitored for baseline pumping performance. Adding this The newest software feature is new feature to the existing Excel format recipe control allows tracking of critical vacuum performance events for optimizing your scheduled maintenance. We offer everything from OEM configurations to remanufactured PC/PLC control systems with all of the latest technologies including on-line service and support. www.semicore.com
SEMICORE Equipment Inc. Sputtering, Evaporation and Etching Systems
Semicore Equipment Inc. specializes in new and  remanufactured sputtering, evaporation and etching systems for the high technology industries. The SC 1500 ISO, In-line Cluster Tool provides cluster tool performance with the flexibility of a pallet carrier system. The bulkheadmounted configuration minimizes use of expensive clean room floor space. These systems typically come with four isolated processing chambers for simultaneous processing in all stations. The SC 1500 ISO In-line deposition tool is based on our standard SC 1500 modular system. Each chamber is isolated as a stand-alone process event with multiple gases, motion control and film depositions of your layered recipe selection. PVD, CVD, evaporation, heat or etching configuration options are available for each isolated chamber. Semicore can supply a custom-built system tailored to a specific process specifications. www.semicore.com
SC 600 Deposition System
Semicore’s SC 600 is a remake of the  classic CHA 600. Customers want to replace aging systems without the worry of process variations from changing tool sets. This system allows the user to go right into production using existing shielding, tooling and other common components. www.semicore.com
SC 3000 Box Coater
Semicore is now offering our SC 3000 box  coater. This configuration allows our design staff to size the box dependent on your PVD coating criteria.Throughput, pumping speed and component selection allows customers to have it their way. www.semicore.com
SC 2000 Deposition Systems
Semicore Equipment Inc. currently offers direct exchanges for many popular platforms such as the original MRC 600/900 series systems, which are widely used. By offering an exchange system, this allows the customer to keep production on schedule during the build cycle. Semicore is also able to perform a product qualification at our facility via the Internet, so your staff need not travel for the preliminary source inspection, or any after delivery service issues. This on-line diagnostics capability allows any Semicore user remote access to the factory’s engineers and technicians.
Semicore Equipment Inc.
Livermore, CA
www.semicore.com
Contact: Christopher A. Malocsay, Vice President
Tel: 925-373-8201
E-mail: malocsay@semicore.com
Combination System with Multiple Deposition Sources
Torr International’s Combination System With Multiple Deposition Sources allows users to start with one source and add on later. Thin Film Deposition System are built to your specifications and many options are available. These world-class custom built systems are used in many universities and research labs across the globe. And our vacuum chambers and systems are state of the art. When you place your order, you have many options to choose from. First decide what type of system(s) you need: thermal evaporation, electron beam evaporation or magnetron sputtering. You can choose any combination of these systems. Then complete our on-line Customer Quote Survey for a price quote. Give us as many details as you can so your quote will satisfy your needs. We also sell all accessories for these systems like sputtering targets, evaporation materials, gas delivery systems, vacuum pumps and hardware, power supplies, load locks, etc. We also render services for depositing different types of materials by sputtering or EB/Thermal for evaluation, prototyping etc. We are evaluating other types of Etchers based on ECR and combination Sputtering/Etching, CVD, PECVD systems as well. www.torr.com
Thin Film & Nanotechnology Deposition and Etching Systems
Torr International, Inc. specializes in Thin Film & Nanotechnology Equipment. The current range of products include Standard Table Top low-priced Magnetron Sputtering systems for diverse applications, from specimen preparation for SEMs to R&D with metal, dielectric and polymer films to Custom-built multi-target sophisticated systems for special applications. We also manufacture Thermal and E-Beam Evaporation systems to suit customers' needs and specialize in Etching systems with different configurations for corrosive and standard applications. We serve a worldwide market in the areas of Thin Film Deposition and Etching as well as high vacuum technology. We also supply all the accessories needed for Thin Film Deposition work.
Torr International, Inc.
New Windsor, NY
www.torr.com
Contact: Dawn Fugazzi, Business Manager
Tel: 1-845-565-4027 or 1-888-MAC-TORR
E-mail: torr@torr.com
Model SP 2000 Sputter Deposition Tool
An affordable sputtering solution, tailored to your  requirements! VPT’s SP 2000 is a flexible, multifunction sputter tool for multilayer metal, reactive, and dielectric thin film coatings, ideal for R&D and small batch production. VPT’s control system and flexible software allows automatic operation with substrate loading/unloading the only required intervention. The 24-inch diameter by 18-inch high SP 2000 comes tailored for your specific application. The standard chuck accepts 2 to 6 inch wafers, loaded through a 10-inch viewport door or optional loadlock. Options include: Confocal or Parallel Cathodes; RF, DC, or Pulsed; Multichannel gas flow control; Downstream pressure control; Top cover with vertical lift; Heated, rotating substrate chuck; Substrate planetary rotation; and Custom sizes are available. VPT is integrated vertically in order to command strategic capabilities – the local and total control of all key fabrication, programming, integration, development, and testing steps. Know-How Transfer plays a special role in satisfying the needs of a diverse customer base, the systems in VPT’s Coating Development Laboratory continue to play an absolutely essential role in the design of thin films, their process development, and on-going process support.
Vacuum Process Technology, Inc.
Plymouth, MA
Tel: 1-508-732-7200
Third-Generation NEXUS Ion Beam Deposition (IBD) System
The third-generation NEXUS Ion Beam Deposition (IBD) system incorporates Veeco’s unique deposition technology to help data storage manufacturers dramatically increase yield, as well as meet the needs of multiple generations from current CIP to advanced CPP devices. It is also ideal for MRAM applications. The NEXUS IBD improves inboard/outboard symmetry, significantly reducing side-to- side imbalances. In addition, sharper takeoff angles and reduction of overspray increase sensitivity. Best of all, the NEXUS IBD can be integrated on a cluster platform with IBE, PVD and other technologies, and is compatible with the current installed base of Veeco deposition and etch cluster tools. www.veeco.com
NEXUS Physical Vapor Deposition System
Veeco's NEXUS Physical Vapor Deposition System offers high throughput and maximum  process control for metal or dielectric appli¬cations, with excellent uniformity and repeatability. Complete process automation produces superior yields, and maximum process flexibility is achieved with the unique parallel process capability. The dual collimation feature provides lift-off processing as well. This PVD System is ideal for data storage (thin film magnetic heads) and telecommunications (FBAR and SAW) device applications. www.veeco.com
SPECTOR™ Optical Coating System
Veeco's SPEC-TOR™ Optical Coating System sets the standard for  precision optical thin-film deposition. The SPECTOR™ system produces compact, low defect density films that are durable under the most harsh operating and environmental conditions. The system is extremely versatile in its application capabilities and therefore provides users with additional business leverage when market ™ forces change direction. Proven SPECTOR applications include, DWDM (100GHz, 50GHz), GFF, Rugate filters, and AR/HR for semiconductors devices and ultra-low-loss films.
Veeco Instruments, Inc.
Woodbury, NY
www.veeco.com
Contact: Fran Brennen, Senior Director of Marketing Communications
Tel: 1-516-677-0200, Ext. 1222
E-mail: fbrennen@veeco.com
ADDENDUM
MARCH 2008
The following Addendum updates the VT&C March 2008 Deposition Sources Product Showcase and includes listings inadvertently omitted for the Delivery Module Enables TEOS-based SiO2 PECVDand the ICP-CVD Delivers Real Benefits in Film Quality by Oxford Instruments Plasma Technology. We apologize for the error.
Delivery Module Enables TEOS-based SiO2 PECVD
Using the Plasmalab® System100 and PlasmalabSystem133 process tools, TEOS (tetraethoxysilane, tetraethyl orthosilicate) offers an alternative PECVD precursor to the commonly-used silane (SiH4.)
The complete TEOS PECVD system enables high  quality, conformal deposition of SiO2 for photonics, dielectric layers and other structures together with control of film stress, deposition directionality and degree of step coverage by controlling oxygen radicals. The TEOS delivery module offers an integrated purpose-designed solution with optimised heated delivery lines to ensure efficient, high-uniformity SiO2PECVD processes and an easy source access and changeover. There is an optional glove-box which can be fitted onto the module for maximum safety and the module can be connected into a clean-room extraction system if required.
ICP-CVD Delivers Real Benefits in Film Quality
Inductively coupled plasma chemical vapour deposition (ICPCVD)  enables the deposition of high density dielectric films at lower temperatures (<150 °C). This is ideal for temperature-sensitive devices such as organic LEDs. By using the ICP-CVD technique, Oxford Instruments has developed a deposition process in which high quality films can be deposited with high density plasma, low deposition pressures and temperatures (as low as 20° for SiO2 and SiNx). Advantages include minimizing film contamination, promoting film stoichiometry, reducing radiation damage by direct ion-surface interaction and eliminating device degradation at high temperatures. Recent data shows that SiNx deposited at low temperature (<150°C) using ICP-CVD gives comparable film process performance to SiNx deposited using high temperature conventional parallel plate PECVD at 300°C, with breakdown electrical fields of more than 3 × 106 Vcm-1 and low leakage currents.
[Reference: “Properties of Silicon Nitride by Room-Temperature ICP-CVD”, H. Zhou et al Plasma Processes and Polymers: 16th International Symposium on Plasma Chemistry, Taormina, Italy June 22-27, 2003 (ed. R. d'Agostino et al.]
Oxford Instruments Plasma Technology
Yatton, Bristol BS49 4AP, UK
www.oxford-instruments.com/plasma
Tel: +44 (0) 1934 837028
E-mail: plasma.technology@oxinst.co.uk
ADDENDUM
FEBRUARY 2008
The following Addendum updates the VT&C February 2008 Leak Detector Product Showcase It includes listings which inadvertently used an incorrect photograph of the PrismaPlus Helium Leak Detector offered by Pfeiffer Vacuum, Inc. We apologize for the error.
Sensitive, Stable and Intelligent RGA
The combination of high sensitivity, stability and intelligent operation is  the added “Plus” in the Pfeiffer Vacuum, Inc. PrismaPlus. It delivers precise and stable results to 300 amu with a detection limit of 1× 10-14 mbar. The Quadera® software is easy to operate and offers an easy-to-read platform for capturing and visualizing all measured data and parameter records.
Pfeiffer Vacuum, Inc.
Nashua, NH
www.pfeiffer-vacuum.com
Tel: 1-603-578-6500
E-mail: prismaplus@pfeiffer-vacuum.com
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Vacuum Technology & Coating