| Thin-Film Deposition and Coating Systems
Compiled by Terrence Thompson, Contributing Editor
This annual product showcase describes many of the thin-film deposition and coating systems used in a wide variety of production, R&D and other applications. The increasingly versatile vacuum-based, thin-film deposition and coating systems just keep getting better and better. Cost-effective and efficient deposition technologies are available for a wide range of thin-film materials to provide end users with many options. Depending upon the system and technology selected, systems can form layers with thicknesses ranging from of a few nanometers to several microns. Thin-film deposition technologies can be physical, evaporative and sputtering systems, or chemical including gas- and liquid-phase processes. Some processes are based on glow discharges and reactive sputtering which combine physical and chemical reactions are known as physical-chemical methods. Thin-film deposition and coating applications are fast-growing, continuing to find new uses ranging from razor blade coatings to quantum-well lasers to superconductors. Advances in thin-film technology for semiconductors, MEMS and photonic devices enable ongoing advanced device fabrication, advanced discrete and waferlevel packaging of microcircuits and optical devices. Applications such as hard-amorphous carbon deposition and metal-interconnect deposition schemes are widely used in semiconductor manufacturing. Other applications benefiting from extremely hard coatings are cutting and forming tools where coatings reduce friction and wear with coating materials such as TiN, CrN, TiCN and AlTiN. PRODUCT DESCRIPTIONS In the following product descriptions, vendors make distinctions to focus on specific intended applications so direct comparisons may be challenging. When in doubt, go to Vacuum Technology & Coating magazine’s home page at and click on the advertiser links for additional details or telephone numbers for calling to discuss your specific application requirements. ATC ORION Series Deposition Systems—Compact, Cost Effective, Research Tools with Modular Design AJA International, Inc.’s introduced its ATC ORION Series deposition system, a compact, feature rich,  premium quality alternative for researchers with limited budgets. Derived from the heritage of the larger, highly popular ATC Series Magnetron Sputter Systems, the ATC ORION offers a design approach that is unrivaled in today's market: All modules are field retrofitable including computer control. These compact tools are available with 1- 10 Torr magnetron sputter sources and can be either HV or full UHV design. The integrated 2-inch magnetrons are special versions of the field proven A300-XP and Stiletto Series modular magnetron sputter sources (over 4000 of these sources operate worldwide). Substrate cooling/heating from LN2 to 1000°C, substrate rotation, substrate RF/DC bias, substrate Z motion, turbo load-lock, RF/DC generators, pulsed DC, automatic closed-loop downstream pressure control and computer control are just a few of the available option m o d u l e s . Finally, in the tradition of AJA's highly uniform, confocal deposition designs, the ATC ORION delivers a minimum guaranteed ± 2.5% thickness uniformity over 4 inches for any material due to a special source design feature (patent applied). www.ajaint.com ATC 1500-E HYBRID UHV Deposition Systems—Sputtering for E-Beam/ K-Cell/Thermal/Ion Beam/Anneal/B Field AJA International, Inc. has delivered numerous, multichamber ATC HYBRID deposition systems with a variety of deposition/modification/analysis techniques such as on axis, con-focal and off-axis magnetron sputtering, evaporation, oxygen anneal, transverse magnetic field application, ion beam assist, milling and oxygenation, RHEED and finally post deposition surface analysis. These UHV chambers are connected via UHV gate valves and magnetic linear transfer tools allowing multiple, incompatible processing steps to be performed on a single substrate without exposure to atmosphere. AJA International, Inc.’s ATC and ATC ORION SERIES deposition systems are always designed to allow attachment of appendage chambers thereby creating the possibility of future ATC HYBRID systems as single purpose tools are expanded. www.ajaint.com ATC 2200 IBAD with ICP Source with 3.0 × 10-4 Torr Deposition Pressure at 1/2 the Cost of Dual Ion Beam AJA International, Inc.’s ATC 2200 IBAD coating tool operates in the same pressure regime as a dual ion  beam system. Traditionally, magnetron sputter sources were unable to sustain their plasma discharge at the pressure where ion sources were most efficient (optimum flux and energy). AJA International, Inc. has now developed a new version of the A300-XP Series Magnetron Sputter Source which is capable of operating into the high 10-5 Torr range and still includes all the features which deliver ±2% uniformity over substrates up to 8 inches diameter. Combining 3 to 4 of these low pressure magnetrons with an ICP RF Plasma/Ion Source delivers highly uniform, ion assisted depositions at rates identical to dual ion beam systems. The ICP source also can be used for milling/pre-cleaning, oxygenation/nitridization (80% + dissociation of O2 and N2) and PECVD. The ATC 2200 IBAD features an metal sealed UHV design, substrate heating up to 1000°C and substrate bias (RF or DC). Operation and geometries are significantly simplified versus dual ion beam systems and the cost is typically much lower to achieve the same results.
Scituate, MA
Contact: William Hale, President Tel: 1-781-545-7365
Hummer 8 Series Planar Magnetron Sputter Systems for Thin-Film Deposition
The AnatechUSA Tabletop thin-film deposition systems (Hummer 6.6 with tilt/rotate stage and thickness  monitor shown here) are sized for Scanning Electron Microscopy sample preparation, research and development, failure analysis and quality assurance applications may be configured for sample preparation for gold coating, CV dot matrix aluminum deposition, silicon dioxide deposition; DC sputter of metals and RF sputter of insulators and metals up to 8-inch diameter substrates.
Hummer 12 Series Planar Magnetron Sputter Systems for Thin-Film Deposition The AnatechUSA Thin-film deposition systems are sized for research and development, failure analysis and quality assurance applications may be configured for CV dot matrix aluminum deposition, silicon dioxide deposition; consecutive or concurrent DC sputter of metals and RF sputter of insulators and metals up to 12-inch diameter substrates. AnatechUSA Hayward, CA Tel: 1-800-390-4449 or 1-510-732-6961
Angstrom Modular PVD Equipment Series
Angstrom Engineering Inc. offers the new Åmod PVD Series thin film deposition system, engineered for diverse  scientific and industrial fields ranging from R&D to preproduction applications. The modular system configuration provides the flexibility to personally customize an advanced system from an extensive list of standard options, which are easily modified and upgraded as technology develops. Powerful process features have been designed into a compact system, making the Åmod a perfect solution for restricted lab space or multiple system integrations. The Åmod's unique design provides over 60 options to choose from, ensuring the capability to configure a vacuum solution to meet your needs. The Åmod vacuum chamber integrates seamlessly into a glove box for environmentally sensitive research and can be configured for a variety of PVD technologies. An Åmod can be configured with thermal evaporation sources, magnetron sputtering sources, a multiple pocket electron beam gun, or a combination of each technology. The optional PLC based control interface of the Åmod provides auto sequence and manual mode operation in addition to advanced deposition rate control. The schematically based real time operation interface improves the usability of the system and provides safety interlock status to the user.
Angstrom Engineering Inc. www.angstromengineering.com Cambridge, ON, Canada
Contact: Andrew Campbell Tel: 1-800-695-8270 or 1-519-653-8883 Ext. 104
Aristo Flat Panel Display Deposition
Applied Materials GmbH & Co. KG provides thin-film deposition solutions for a broad range of  applications in the electronics as well as in the functional glass and in the food and beverages industries. A leading supplier of in-line thin-film deposition systems for the Flat Panel Display (FPD) manufacturing industry, Applied Films builds on over 20 years of experience in this market segment. The Aristo thin-film technologies are focused on flexibility, reliability and high performance in applying conductive, optical and barrier coatings with excellent film properties for liquid crystal displays and other FPD applications. Because most of the applications of FPD involve high speed production processes, the proven Applied Films’ in-line sputtering system design enables our customers to gain improved economies of scale in production and thus reduce production costs. In addition, we continuously enhance the entire range of deposition processes in use by our customers through constant research and development. Pointing to distinct technology trends, OLED is a technology priority for us in the FPD market. We developed the first vertical In-Line sputtering deposition system to provide OLED manufacturers with the ability to produce OLED devices in volume production. As the information age proceeds, our thin-film deposition systems enable FPD manufacturers to lead the way by accelerating production processes, featuring high throughput and low costs of ownership in price and quality sensitive markets.
The TOPMET
Vacuum Web Deposition System for Modern Packaging Needs
Applied Materials GmbH & Co. KG provides high vacuum web thin-film deposition systems for the production  of advanced packaging substrates like thin plastic or metal foil. Targeting the sophisticated demands in the production of innovative packaging material, these systems sputter thin metal or oxide films in a roll-to-roll process for applications such as food packaging . The resulting microscopically thin layer creates a moisture or oxygen barrier promoting freshness and extending the shelf life of the consumer products which use these films. Our web thin-film solutions are also used in the manufacture of certain electronic products. In this context, thin films serve as conductive coatings in applications such as capacitor and touch panels. Our superior machine design and modularity maximizes coating uptime by reducing requirements for cleaning, pumping and substrate and target exchange. As our customers look for machines which can provide the highest thin-film quality and the lowest costs of ownership, the Applied Films’ market leading web coating solutions with the largest installed base in the world are an excellent choice combining flexibility for different applications as well as technical and cost advantages.
Applied Materials GmbH & Co. KG Alzenau, Germany
Tel. +49 6023 92 65 65
BENCHMARK 800-III® ICP Deposition and Etch System
AXIC, Inc.’s BENCHMARK 800-III® Inductively Coupled Plasma (ICP) Processing System is an  affordable high-performance low temperature PECVD and DRIE plasma processing system. The BENCHMARK 800-III® defines a new concept in low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (PECVD) plasma processing and Deep Reactive Ion Etch (DRIE). The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch and deposition bottom electrodes available for easy installation into the chamber unit. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing of the BENCHMARK 800-III® unsurpassed by any other plasma product in the market. In the research and development of plasma processing, there has always been a great need for a highly versatile and reliable tool. With the ever-changing requirements in plasma research, the system selected must offer the widest range of process parameters and a high degree of repeatability for process verification. It also must be easily modified for new process requirements. We believe that our BenchMark 800-III® ICP deposition/etch plasma system satisfies these very demanding requirements.
Axic, Inc. Santa Clara, CA Tel: 1-408-980-0240 or 1-800-475-2762
Web Roller-Coaters for Thin-Film Deposition
CHA Industries provides web roller-coaters for thinfilm deposition applications that are individually configured  to meet end-users requirements. Production capability ranges from small R&D quantities to full production runs. CHA’s web roll-coaters are capable of processing plastics, metal ribbon, and metal foil substrates in a wide thickness range. Applicable industries include photovoltaics, superconductors, OLEDs, flexible circuits and displays, and optical and barrier coatings. CHA has experience integrating sputter magnetrons, electron-beam guns, resistance sources, ion-guns, and plasma bars into their web roll-coaters. Sputter sources may be configured for direct (chill-drum) or free-span (gentle roll wrap) deposition. For optimal film uniformity and throughput, CHA provides PLC automated process control with a real-time interactive HMI, digital control of web speed, tension, and accurate rewind, and closed-loop pressure and flow control of multiple reactive and non-reactive process gases. CHA is one of the principal tool suppliers to the US Display Consortium for the development of flexible displays.
Mark 50 Thin Film Deposition System CHA Industries’ Mark 50 Systems are the acknowledged industry workhorse, set-ting the standard for high vacuum deposition sys-tems by providing the utmost simplicity in design, ease of operation and  unmatched reliability to ensure high throughput. This makes the Mark 50 ideal for the full spectrum of evaporation and sput-tering process applica-tions from large produc-tion runs to small R&D quantities. It can handle any substrate size, shape and material; and enables users to enter program data from a disk, keyboard, mouse or screen function. Additionally, the Mark 50 handles any source including RF and DC sputtering. electron or ion beam, resistance or RF induction and it features ergonomically enhanced trackless planetary fix-turing, and a horizontal 32 × 32-inch cylindrical chamber with a lower, slide-down front door that minimizes floor space requirements and facilitates stress-free loading and unloading. There is also a rear door that provides con-venient chamber access for throughthe-wall mounting.
Solution for PVD CHA Industries’ Solution™ for PVD is a small-scale vacuum deposition system designed for small lot  processing (at universities, R&D labs, etc.) and typically sells for under $48,000. While compact in size at 24-ft D × 46-inchW × 65.5-inch H, the Solution system has many of the high-per-formance features as found in CHA's large-scale Mark 40 and Mark 50 PVD systems, like a fully water- cooled stainless steel chamber for optimizing process start temperatures. This vacuum chamber comes in a standard 18 D × 18 W × 24-inches H size with a volume of 4.5 ft3 . Other features include manual or PLC control, plenty of space for accommodating a large volume electron beam gun or resistance source, and a choice of pumping packages, i.e., diffusion, cryo-genic or turbo molecular pumps. For the Solution, CHA pro-vides a variety of high quality tooling, such as lift-off dome, planetary, variable-angle and others; as well as a wide range of source choices, including swing and resistance.
CHA Industries, Inc. Fremont, CA Tel: 1-510-683-8554
Integrity Series Evaporation
The Denton Vacuum LLC Integrity series provides Evaporation technology using multiple resistance and electron beam gun configurations. Chamber geometry is optimised for the specific application. IAD processes, optical monitoring and sophisticated automation and controls are typical features of these machines. Various fixturing arrangements offer increased uniformity and flip-over tooling is available for coating both sides of a substrate. The Integrity has been supplied in chamber sizes from 20 to 80 inches for applications as diverse as ophthalmic coating, laser bar facet coating, precision optics and optical filters. The Explorer series offers small scale manufacture and R&D application with various configurations in a small footprint. A single electron-beam gun can be configured with IAD and sputtering cathodes for development applications. Denton Vacuum is celebrating over 40 years as a leading supplier of thin-film coating equipment with an established range of systems offering flexibility and performance to meet the most demanding applications. Denton offers a unique combination of hardware configuration, automation and controls, and process assistance to create powerful depositions systems for industry and research. www.dentonvacuum.com Discovery and Explorer Series Sputtering Systems The Denton Vacuum LLC Discovery series provides Sputter technology with a standard hardware configuration  with a choice of 1, 2, 3, or 4 cathodes. The Discovery series has proven to be extremely successful with over 80 units installed worldwide. Cathodes from 2 to 4 inches are standard. Systems can easily be upgraded in the field to add additional cathodes. DC and RF power are offered, along with a selection of loadlocks for single or multiple substrate transfer. Denton offers both confocal and perpendicular cathode arrangements. This allows the user to select between enhanced uniformity on single samples or for liftoff applications. The Discovery has been supplied in chamber sizes from 18 to 35 inches. The Discovery 550 is available with increased clean-room compatibility. The Explorer series offers small scale manufacture and R&D application with various configurations in a small footprint. A choice of up to three cathodes can be configured.
Denton Vacuum LLC www.dentonvacuum.com Moorestown, NJ
Contact: David Mount, Sales Manager Tel: 1-856-439-9100
Nanochrome I Load Lock
Intlvac’s Nanochrome™ I Load Lock system (NCI-LL) is a high-precision R&D/Pilot Electron Beam  Evaporator. Numerous configurations are possible, all tailored to your specific application. With it’s small footprint, low cost, and ease of operation, the NCI-LL systems is an ideal choice for pilot projects and research. The NCI-LL system incorporates a clamshell style chamber, which gives you easy access to all parts of the chamber. It can be designed for a number of different substrate holders such as: flat plate planetary, flip fixture planetary, or a planetary dome. Substrate revolution and rotation ensures an even coating. Inside the NCI-LL, you’ll also find quartz halogen lamp heaters and fully automated shutters for total process control. www.intlvac.com
Nanochrome II Load Lock
Intlvac’s Nanochrome™ II Load-Lock (NCIILL) is an ideal tool for metal films, optical and precision optical  coating. Our 32” × 36” chamber supports a wide variety of substrate holders such as: flat plate planetary, planetary domes, flip fixtures, and “Lift Off”. The system can be configured with a variety of thin film deposition sources such as electron beam guns, magnetron sputter cathodes, and thermal sources. Turn key process support: Intlvac’s in house experts can develop and custom tailor your deposition process, from Diamond-like carbon (DLC) coatings, to AR coatings. The load-lock on the NCII-LL allows for fully automatic transfer of the substrate to the substrate holder in the chamber. www.intlvac.com
Nanoquest I Ion Beam Sputtering System The Intlvac Nanoquest Research Ion Beam Sputtering system is a flexible, low cost platform for advanced ion beam materials processing research. Utilizing a compact chamber configuration and a choice of vacuum pumping options, the Nanoquest can be configured with single or dual ion beams, multiple sputter targets, and reactive gas handling to perform inert or reactive etching and ion beam deposition. Key to the systems operation is a direct water-cooled substrate stage which provides rotation and tilt during deposition and etching. Ion Beam Sputtering can deposit insulators and conductors during the same run.
Intlvac www.intlvac.com Georgetown, Ontario, Canada
Contact: Miguel Pereira Tel: 1-905-873-0166
600 i Series Sputtering Systems KDF’s 600 i Series is targeted towards sensitive applications requiring material that produces particulate  contamination. The tools in this family surpass the criteria for deposition of thin films in high-density devices and other applications requiring absolutely minimal defects. The 600 i Series features multiprocess sputtering for increased process flexibility and higher throughput. The 643 i’s advanced mechanical and electrical design features result in tight process control, high reliability and extremely low defect rate. Process control features include a palletized batch processing area that allows instantaneous changing of wafer sizes, enabling both front and back side GaAs wafer processing. In addition, a sophisticated temperature control system maintains low wafer temperature during heat sensitive sputtering phase. The 654 i and 654 ix systems were developed for the rapidly growing telecommunications and compound semiconductor markets, the 654 tools can be applied to a full range of leading edge microelectronic component manufac- turing applications. The system provides enhanced etch and deposition uniformity and high-speed batch processing. Featuring cathode selectable collimator technology, the 654 ix substantially increases lift-off performance, an enabling sputtering capability that raises the system's overall cost effectiveness. Capable of integration with current systems, the new 654 ix was developed to provide increased volume capacity by enabling multiple substrate material processing, or “multiplexing.” www.kdf.com 744 i Large Area, Four-Target, Batch Sputtering System The KDF 700 i Series includes the KDF 744 i is a large area, four-target, batch sputtering system,  designed for processing high-density interconnect, 200mm semiconductor wafers and flat panel displays. The tool was developed to meet increasing customer demand for higher throughput with larger substrates. It is a vertical sputtering system with a 19 × 19-inch pallet area. The compact footprint that uses less than one-third the floor space of most competing equipment. High-vacuum loadlock, a capacity to process up to four 200mm wafers or multiple smaller wafers at a time and throughput for 200mm wafer metallurgy is increased four times with cassette-to-cassette capability. The tool features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers. The 744 i is also available as an enhanced tool with a Negative Sputter Ion Beam that provides excellent ITO coatings on polycarbonate substrates at very low temperatures. www.kdf.com 844 i Large Area Sputtering System
The all new KDF 844 i is a large area system targeted at the demanding process requirements of high-density  interconnect, 300mm semiconductor wafers and flat panel displays. This all new system has been totally redesigned from the ground up and now utilizes some of the latest advances in today’s technology. The 844 i was conceived to meet increasing demand for higher throughput with larger substrates. Based on the company's production-proven platform of in-line sputtering systems, the 844 i offers manufacturers an efficient large area processor with the footprint of a small system. The tool features two processing palettes, allowing instantaneous change of wafer sizes and the ability to process both the front and back side of the wafer. Targets on the 844 i are available in a variety of high-efficiency formats. The tool has a target utilization rate of up to 60 percent. KDF 944 i , 954 i and 954 ix. www.kdf.com Precision Sputtering Systems
The KDF 944 i, 954 i and 954 ix systems are designed to meet today’s stringent production requirements,  the 900 Series offers process flexibility typically found in R&D systems. The 900 Series surpasses the criteria for deposition of thin films in high-density devices and other applications requiring absolutely minimal defects. The 900 Series systems are equipped with KDF’s exclusive and innovative ERPP (enhanced rotary planetary pallet), which provides greatly improved wafer uniformities. In tandem w i t h K D F ’s cathodes, this pallet option can achieve better than ±1% uniformities across the pallet and better than 0.5% repeatabilities between runs for dielectrics such as SiO2 and TiO2, compared with traditional pallet uniformities of ±15 to 20% for such materials. The 943 i is ideally suited for manufacture of thin films for hybrid circuits for defense, aerospace and space telecommunications applications. These applications normally require a repeatable, highthroughput process for producing uniform films. The 954 i is designed for processing GaAs and other compound semiconductor applications. The system is available in the standard 954 i configuration and as the 954 I, which offers the option of extended cathodes and increased uniformity. The 954 i is a four-target batch sputtering tool for both front and backside deposition, providing high utilization that increases cost-effectiveness and productivity. The 954 ix is equipped with extended cathodes and increased uniformity.
KDF Electronic & Vacuum Services, Inc. www.kdf.com
Rockleigh, NJ Tel: 1-201-784-5005
The Kurt J. Lesker Company PVD 75 is a versatile, value engineered, R&D vacuum system which can be  configured to suit a variety of thin-film deposition applications. Standard features include: a front loading box chamber, turbomolecular pump package, integrated touch screen control, and a fully enclosed “zero” cleanroom footprint when flush wall mounted. Source flange options include magnetron sputtering, electron beam evaporation, thermal evaporation and low temperature evaporation furnaces. To ensure new product reliability, the PVD 75 is built using proven process modules from other standard Kurt Lesker Company thin-film deposition systems.
AXXIS Thin-Film Deposition System for R&D
Kurt J. Lesker Co.’s AXXIS is a cost effective, versatile thin-film deposition system for R&D and  limited production applications. Although the AXXIS is a multi-technique system, it has a very small footprint. Its 304 SS chamber has a hinged front loading door, high vacuum pumping, enclosed frame, and safety interlocked operation. Standard deposition process modules are: magnetron sputtering, e-beam evaporation, and thermal evaporation. But the modular manufacturing approach allows easy adaptation to PECVD, plasma cleaning, and ion source installation. AXXIS produces single-layer and multi-layer films, and allows co-deposition. A variety of options are available including a Windows-based computer control system and a variety of substrate handling tools. www.lesker.com
KJLC Box Coater Series
Kurt J. Lesker Co. manufactures a series of cost effective Box Coater PVD systems where the demand is for  high process throughput. Chamber sizes ranging from 24 to 48 inches allow substrate fixtures of varying shapes, sizes, and applications to be accommodated. The KJLC 3000 and HPD40 are suitable for a variety of PVD techniques such as magnetron sputtering, thermal evaporation, ebeam evaporation, or customized methods. Process options include: substrate heating/ cooling; substrate biasing; and ion source installation. High substrate throughput is assured by several pumping options including cryopumps, turbopumps, and “in-chamber” cryogenic pumps for water vapor. Closed loop control of process parameters and fully automatic operation is achieved through each system's computer control.
CMS Family of Deposition Systems The Kurt J. Lesker Co. Combinatorial Materials Science (CMS), initially developed to facilitate  drug research, has been subsequently applied to new thin-film materials syn- thesis to enhance effects such as GMR. Our CMS thinfilm deposition tools extend ‘traditional’ thin-film methods using combinatorial techniques into the rapidly advancing field of Spintronics. The CMS tools are modular, easily configured high vacuum and UHV tools for combinatorial PVD. The standard platforms, CMS-18, CMS-24, and CMS-A, distinguished by chamber diameters, allow an ever greater variety of internal options. The standard PVD modules available are: magnetron sputtering, e-beam evaporation, kcell sources, and thermal evaporation. But the CMS tools can be readily adapted to other techniques such as PECVD. All CMS Tools are available with load locks, specialized substrate stages, sequential or co-deposition capability, and a Windows-based comprehensive computer control system. Our modular manufacturing makes the CMS family highly reliable, exceptional versatile, cost effective, with a short delivery time. www.lesker.com LUMINOS Cluster Tool
Kurt J. Lesker Co.’s LUMINOS Tool is a multichamber thin-film deposition and analysis system for R&D or  pilot production applications. Its central distribution chamber is surrounded by a maximum of six radial process modules. The standard process modules are: substrate load lock; mask library; magnetron sputtering; thermal evaporation; electron beam evaporation; plasma cleaning; thermal annealing; oxidation; and analysis. The LUMINOS Tool is designed for any thin-film deposition, device fabrication, or analysis technique requiring in-vacuum transfer between chambers. Vacuum environments are high vacuum to true UHV. The base-level LUMINOS tool has manual substrate transfer. However, automated substrate transfer and a Windows-based comprehensive computer control package are options. www.lesker.com
SPECTROS‘ Deposition System for R&D Kurt J. Lesker Co.’s SPECTROS is a versatile thin-film deposition system for R&D investigations  into small organic molecule devices. Applications include OLED, PLED and
organic TFT structures. The single chamber system has both organic and metal evaporation sources, in situ mask changing, and a glove box interface. The typical SPECTROS system has four Lesker LTE (low temperature) organic evaporation sources and two (high temperature) metal evaporation sources. At its limit, SPECTROS can have eight organic sources and three metal sources simultaneously installed. Quartz crystal deposition monitors precisely control of film thickness and host/ dopant ratios. A Windows-based, comprehensive computercontrol package is included.
OCTOS Cluster Tool Kurt J. Lesker Co.’s OCTOS is a pre-production / full-production tool for a range of PVD applications. It is  based on a “cluster” platform with: entry and exit load locks; central robot distribution module; reactive plasma cleaning chamber; mask storage chamber; and various deposition chambers that can including magnetron sputtering, low temperature evaporation (for OLEDs), thermal evaporation, and e-beam evaporation techniques. OCTOS has exceptional layer thickness uniformity, repeatability, reliability, and substrate throughput. It is available in high vacuum and UHV versions and can be configured to process a range of substrates sizes including 6-inch diameter discs and 400 × 400mm plates.
Custom Deposition Systems
Kurt J. Lesker Co. delivered its first deposition vacuum system, well over 20 years ago.  We designed it “from scratch” and delivered it meeting the customer’s specification. Over the years we have build many hundreds of complete systems and few thousand chambers. Today, at design and manufacturing locations in the U.S. and the U.K., we design, build, test, and delivers an exception range of standard and totally custom deposition systems. By leveraging this vast technical and engineering background, we have archived a staggering array of solutions to meet the most unique application requirements. Coupling this vast applications library, our vacuum engineering expertise, our modular manufacturing approach, and our huge machine shops equipped with the latest machining centers, we approach the most novel custom deposition application with: cost effective and proven design skills; thoroughly established assembly methods; an extensive base of systems testing; and confidence.
Clairton, PA
Contact: Duane Bingaman, Vice President, Sales and Marketing Tel: 1-412-533-4304 or 1-800-245-1656
Uncompromising performance and a compact design is found in the current Leybold Optics’ BOXER model for  prescription as well as for mass production optics. This maintenancefriendly system is suitable for clean room use. An effective electron beam evaporator does its work at the center of the coating chamber. Thanks to the unsurpassed Leybold Optics knowhow the component parts of this system can be assembled in various cost-effective combinations to meet the individual requirements of customers. Leybold Optics is a leading manufacturer in this market. For display systems or the coating of lenses, flexible materials, and three-dimensional molded parts: our systems convince with their excellent results and their easy maintenance. From classical broadband anti-reflection coatings to absorption layers (protection against the sun) - a great number of different processes can be carried out with BOXER. Moreover, if the demands on the system happen to change, its hardware can easily be expanded.
Alzenau, Germany
Contact: Mrs. Isa Fröhling, Marketing Services Tel: +49-(0)6023-500-190
E-Mail: marketingservices@leyboldoptics.com
Series PB3 Educational and Training Plasma System Manitou Systems Inc. addresses the Systems Series PB3 Plasma System need for a flexible and low cost educational/proof of concept tool. This modular system is available with either a sputtering or high-density plasma source and includes only basic features. The chamber consists of a 6-inch cross, 4-inch diameter substrate holder, O-ring sealed door with view port and provisions for connecting a vacuum pump and pressure/flow measurement components. An integrated 13.56MHz RF generator and manual impedance matching network module complete the package. To keep the selling price low, the user can populate the PB3 with a vacuum pump, valves and other process related components from their own stock or by purchasing new components from their favorite vendor.
Manitou Systems Inc. Newtown, CT Tel: 1-203-270-8797
eVap® Vacuum Thin Film Deposition Coaters
MDC produces state-of-the-art thin-film vacuum coating equipment. MDC currently supplies users in the optical, metallurgical, medical, semiconductor, research and development, university and OEM  marketplace. Numerous applications include sunglasses, mirrors, laser optics, camera lenses, optical filters, infrared detectors, anti-reflective coatings, nano-technologies, medical devices, superconductors, telecommunications, automotive decorative trim, costume jewelry, corrosion resistant coatings, stage and entertainment lighting, fiber optic coating, display technologies and MEMS technology. The e-Vap® Product Line offers a wide range of choices and options. We understand that every vacuum system configuration may be different. We offer many standard off-the-shelf components as well as customized designs to suit your particular deposition equipment need. The e-Vap® product line supports two distinct evaporation methods: the first being thermal or resistive evaporation and the second being electron beam evaporation. The Re-Vap resistive evaporation sources are a most economical and reliable method of depositing thin films onto surfaces. In general terms, electric current passes through a resistive element that generates sufficient heat to melt and evaporate various coating materials. Materials commonly evaporated include iron, nickel, aluminum, copper, tin, silver, gold and chrome. Three basic resistive element designs are offered: filament coil, metal foil and oxide crucible types. Filament coil designs are the most popular. All resistive elements are relatively inexpensive and can be discarded after each use or after several uses. MDC offers an unprecedented selection of electron beam evaporation sources and control electronics. Electron beam evaporation is the most versatile means of vacuum evaporation and deposition. This technique allows the production of thin-film coatings from pure elements, numerous alloys and compounds. Electron beam evaporation offers several advantages over competing processes including precise control of low or high deposition rates, excellent material utilization, sequential and co-deposition and uniform low temperature deposition. It also offers relatively high evaporation rates, freedom from source contamination, precise film compositions and cooler substrate temperatures. The materials used for evaporation are available in near limitless shapes and forms, the most common being pellets, slugs and disks.
MDC Vacuum www.mdcvacuum.com Hayward CA
Contact: Ken Allen Tel: 1-510-265-3500 or 1-800-443-8817
MeiVac (Comptech) HEDA RF
Diode Dielectric Sputtering Tools The MeiVac (Comptech) HEDA RF Diode production dielectric sputtering systems. HEDA is a  standard of the Magnetic Storage Industry with over 200, 2460 and 2480 systems in worldwide use and 25 years of continuous manufacturing and Worldwide Support. HEDA’s feature target/substrate carrier sizes of 17 × 17-inches (2460) or 20 × 20-inches (2480). Custom wafer sizes, batch loads and specific process configurations are built to customer specification. Pump options include single cryopump, double cryopump or turbo/ cryogenic water pump. RF bias is standard for stress reduction, improved uniformity and edge coverage. Helium backside cooling provides high deposition rates. Process development is key to maintaining production qualification in an ever-changing technology. Hardware development extends production system life with upgrades or complete retrofits of wafer size, pumping, deposition power or process control systems.
MeiVac 602 Cluster Dielectric Sputtering Tools
The MeiVac 602 multi-chamber cluster tools are available with single, double or triple chamber configurations.  RF Diode, RF Planar Magnetron or Pulsed DC Planar Magnetron deposition technology is standard. Over 35 are used in worldwide production with 11 years of continuous manufacturing and worldwide support. MeiVac systems are a Standard of the Magnetic Storage Industry. Helium backside cooling is used and can handle up to 200mm wafers. Target/substrate carrier sizes are tailored to customer requirements. Pump options include cryopump or turbo/cryogenic water pump. RF bias for stress reduction, improved uniformity and edge coverage is standard. Process development is key to maintaining production qualification in an ever-changing technology. Hardware development extends production system life with upgrades or complete retrofits of wafer size, pumping, deposition power or process control systems.
Meivac Inc. www.meivac.com Contact: Harry Grover, Marketing and Sales Manager Tel: 1-408-362-1000 Ext. 359
E-mail: harry.grover@meivac.com
SC 600 Deposition System Semicore Equipment Inc.’s SC 600 is a remake of the old favorite CHA 600.  Our customers wanted to replace aging systems without the worry of process variations from changing tool sets. This system allows the user to go right into production using existing shielding, tooling and other common components. www.semicore.com
SC 3000 Box Coater Semicore Equipment Inc. is now offering our SC 3000 box coater. This configuration allows our design staff to  size the box dependent on your PVD coating criteria. Throughput, pumping speed and component selection allows customers to have it their way. SC 2000 Deposition Systems Semicore Equipment Inc. is a leading supplier of new and remanufactured thin-film deposition systems. We currently offer direct exchanges for many
popular platforms such as the original MRC 600/900 series  systems, which are still widely used. By offering an exchange system we allow the customer to keep production on schedule during the build cycle. Semicore is also able to perform a product qualification at our facility via the Internet, so your staff need not travel for the preliminary source inspection, or any after delivery service issues. This on-line diagnostics capability allows any Semicore customer remote access to the factory’s engineers and technicians.
Semicore Equipment Inc. www.semicore.com Livermore, CA
Contact: Christopher A. Malocsay, Vice President Tel: 925-373-8201
Super Series Production Sputtering System
T-M Vacuum Products’ Super Series Production Sputter Systems are available with internal chamber sizes ranging from 24 to 80 inch3, using single or multiple magnetron  sputtering and/or cathartic arc coating sources. The stainless steel chamber’s true “dual wall” design ensures the vacuum chamber receives 100% un-compromised water-cooling with no risk of leak. The T-M Production Sputter Systems line is available with a choice of either single or multiple cryogenic, turbomolecular or ion sublimation vacuum pumping principles and can be configured to achieve high and ultra-high vacuum environments. All sources incorporate independent shutter systems and each source is mounted on an adjustable “linear drive” assembly located at different sections of the coating chamber. The drive assembly allows each source to move freely in a horizontal configuration allowing true source-to-substrate distance characterization for a more uniform coating. Multiple sources can be configured for sequential or co-deposition film processes and are controlled by quartz crystal monitor for film rate, thickness and density. Optical thin-film monitoring for wavelength control and “cutoff” can be achieved using either automatic witness glass chip holder and/or computerized sample and hold tech- niques. RF, DC and DC-Pulse magnetron sputtering are available. One of the main features usually associated with the Super Series Production Sputter System is use of an automated substrate load lock and handling system for greater throughput with virtually no contamination and/or oxidation to the substrate.
Smart-Jar Load Lock System T-M Vacuum Products’ standard line of Super Series™ Smart-Jar Bell Jar and Collar-Type Coating Systems are available with internal chamber sizes ranging from 18 to 48 inches diameter and up to 48-inches high.  Our base size Smart-Jar bell jar measures 24-inches diameter × 30-inches high (with a usable internal volume of 7.88 cubic feet) and the bell jar chamber and all its components are manufactured from 304L stainless steel with a number 4 electro-polished finish on all inner and outer surfaces. The jar’s true “dual wall” design ensures the vacuum chamber receives 100% uncompromised water-cooling with no risk of leak from damaged cooling channels or tubing lines. Each bell jar system is mounted to a stainless steel “O” ring-sealed base plate that incorporates all necessary pumping ports and feed-throughs required for operation. 4-inches ports with manually operated shutter assemblies provide viewing access. The Smart-Jar Series bell jar features a main, “self-centering” split seal located in the center of the jar that divides the jar in half for more efficient cleaning and foiling. The lower portion of the jar rests on the base plate during operation and can be lifted by an integrated hoist when cleaning and/or maintenance is required. Single or multiple source electron-beam, thermal evaporation, magnetron sputtering and cathartic arc coating sources are available along with a choice of single or multiple cryogenic, turbomolecular or ion sublimation vacuum pumps to achieve high vacuum process environments. All sources incorporate independent shutter systems and each electron beam source is mounted on an adjustable “stage” assembly located at the base plate of the bell jar chamber. The stage assembly allows each source to move freely in a 90° arc and can be raised or lowered to allow true source-to-substrate distance characterization for a more uniform coating. Multiple sputtering sources can be configured for sequential or codeposition film processes in a vertical, horizontal, up, down and/or conical sputtering configuration. Film rate, thickness, and density are controlled by quartz crystal monitor while optical monitoring for wave length control and “cutoff” can be achieved using either automatic witness glass chip holder and/or computerized sample and hold techniques. RF, DC and DC-Pulse magnetron sputtering are available. Use of an ion source for Ion Assist Deposition (IAD) in conjunction with electron-beam and thermal film deposition is also available for harder, more dense films. PC/PLC-based recipe and data management control are available as a standard option.
T-M Vacuum Products, Inc. Cinnaminson, NJ Tel: 1-856-829-2000
Thin Film & Nanotechnology Deposition and Etching Systems Torr International, Inc. specializes in Thin Film & Nanotechnology Equipment. The current range of products  include Standard Table Top low-priced Magnetron Sputtering systems for diverse applications, from specimen preparation for SEMs to R&D with metal, dielectric and polymer films to Custom-built multi-target sophisticated systems for special applications. We also manufacture Thermal and E-Beam
Evaporation systems to suit customers' needs and specialize in Etching systems with different configurations for corrosive and standard applications. We serve a worldwide market in the areas of Thin Film Deposition and Etching as well as high vacuum technology. We also supply all the accessories needed for Thin Film Deposition work.
Torr International, Inc. www.torr.com New Windsor, NY
Contact: Dawn Fugazzi, Business Manager Tel: 1-845-565-4027 or 1-888-MAC-TORR
An affordable sputtering solution, tailored to your requirements! VPT’s SP 2000 is a flexible, multifunction sputter tool for multilayer metal, reactive, and dielectric thin film coatings, ideal for R&D and small batch  production. VPT’s control system and flexible software allows automatic operation with substrate loading/unloading the only required intervention. The 24-inch diameter by 18-inch high SP 2000 comes tailored for your specific application. The standard chuck accepts 2 to 6 inch wafers, loaded through a 10-inch viewport door or optional loadlock. Options include: Confocal or Parallel Cathodes; RF, DC, or Pulsed; Multichannel gas flow control; Downstream pressure control; Top cover with vertical lift; Heated, rotating substrate chuck; Substrate planetary rotation; and Custom sizes are available. VPT is integrated vertically in order to command strategic capabilities – the local and total control of all key fabrication, programming, integration, development, and testing steps. Know-How Transfer plays a special role in satisfying the needs of a diverse customer base, the systems in VPT’s Coating Development Laboratory continue to play an absolutely essential role in the design of thin films, their process development, and on-going process support.
Sputtering And Evaporation – Inline!
VPT’s Inline and Multi-Chamber Vacuum Systems provide tremendous competitive advantages over  conventional batch processing. Operating sequential process steps in parallel unleashes design flexibilities and a long list of advantages, including: Higher throughputs, lowered costs; Mixed production for less downtime, more scheduling flexibility; Modular designs adapt to future product demands; and Less sensitivity to humidity results in better, more predictable yields. VPT can meet your needs. VPT’s experience with all types of multichamber systems and processes insures that you will get an optimum solution for your unique application that meets your unique needs. Please visit for more information about VPT’s ADVANTAGE Inline Evaporation Systems for precision optics and Model CCS3 Modular Inline Sputtering systems. VPT is integrated vertically in order to command strategic capabilities – the local and total control of all key fabrication, programming, integration, development, and testing steps. Know-How Transfer plays a special role in satisfying the needs of a diverse customer base, the systems in VPT’s Coating Development Laboratory continue to play an absolutely essential role in the design of thin films, their process development, and on-going process support.
Vacuum Process Technology, Inc. www.vptec.com Plymouth, MA
Contact: Jim Snyder, Sales and Marketing Tel: 1-860-836-1716
E-mail: sales@vptec.com
Third-Generation NEXUS Ion Beam Deposition (IBD) System
The third-generation NEXUS Ion Beam Deposition (IBD) system incorporates Veeco’s award-winning deposition technology to help data storage manufacturers dramatically increase yield, as well as meet the needs of multiple generations from current CIP to advanced CPP devices. It is also ideal for MRAM applications. The NEXUS IBD is designed to improve inboard/outboard symmetry, significantly reducing side-to-side imbalances. In addition, sharper takeoff angles and reduction of overspray increase sensitivity. Best of all, the NEXUS IBD can be integrated on a cluster platform with IBE, PVD and other technologies, and is compatible with the current installed base of Veeco deposition and etch cluster tools.
NEXUS Physical Vapor Deposition System Veeco's NEXUS Physical Vapor Deposition System offers high throughput and maximum process control for  metal or dielectric appli-cations, with excellent uniformity and repeatability. Complete process automation produces superior yields, and maximum process flexibility is achieved with the unique parallel process capability. The dual collimation feature provides lift-off processing as well. This PVD System is ideal for data storage (thin film magnetic heads) and telecommunications (FBAR and SAW) device applications.
Veeco Instruments, Inc. www.veeco.com Woodbury, NY
Contact: Fran Brennen, Senior Director of Marketing Communications Tel: 1-516-677-0200, Ext. 1222
Veeco’s SPECTOR™ Optical Coating System sets the standard for precision optical thin-film deposition. The SPECTOR™ system produces compact, low defect density films that are durable under the most harsh  operating and environmental conditions. The system is extremely versatile in its application capabilities and therefore provides users with additional business leverage when market forces change direction. Proven SPECTOR™ applications include, DWDM (100GHz, 50GHz), GFF, Rugate filters, and AR/HR for semiconductors devices and ultra-low-loss films.
Veeco Instruments, Inc. www.veeco.com
Fort Collins, CO
Contact: Brian Knollenberg, Director of Marketing Tel: 1-970-221-1807, Ext. 312
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Vacuum Technology & Coating